Webinar CMC du 26 novembre sur l'encapsulation et l'assemblage !
3IT.nano processing capabilities
Front end service
- •Design consultation.
- •Photomaskfabrication on 25 mm x 25 mm to 175 mm x 175 mm plates.
- •Process development on Si, Ge, SiGe, SiC, GaN, III-V, II-VI, diamond, glass, quartz and various polymers.
•Substrates: opaque, transparent and semi-transparent such as Si, SiGe, Ge, GaAs, InP, ZnSe, GaN (on sapphire or on Si), quartz, LiNbO3.
•Wafer size: from small dies up to 150mm wafers.
•Contact and proximity alignment and exposure.
•Deep UV flooder.
•Minimum resolution of 1 μm on thin resist with 2 μm alignment accuracy.
•Double sided lithography with back side alignment accuracy of 5 μm.
•Positive resists from 450nm to 25 μm thick (Shipley S1800, AZ4000, AZ9000).
•Negative resists from 2μm to 100μm thick (AZNlof2020, SU-8, KMPR).
•Dual-layer lift-off resist : PMMA, PMGA, LOR.
•Laminated Dry films : DupontMX film.
•PDMS deposition and patterning.
Electron beam lithography